MEMS Process Engineer

HRL's compact, high-performance Inertial Sensors (IMU) are redefining navigation systems by providing reliable guidance in GPS-degraded environments. Designed with navigation-grade precision, these IMUs offer a cost-effective, scalable solution for automotive, aerospace and other demanding applications where traditional GPS reliance is no longer sufficient. These innovations aim to deliver a first-of-its-kind navigation-grade component, providing industries with a reliable, economical alternative to traditional IMUs and advancing capabilities for autonomous systems and precise navigation.

As an important member of our MEMS cleanroom fabrication team, you will have the opportunity to innovate and create novel microfabrication processes and integrate them into fully optimized process flows that will be applied to our cutting-edge wafer-scale sensors and actuators R&D efforts.

You will participate in the design, layout, fabrication, and characterization of MEMS-enabled devices and subsystems.

You will also conduct layout design and designs of experiments.

Through in-process wafer inspections and metrology data, you will provide timely feedback to project teammates.

Hands-on semiconductor wafer processing experience in an R&D Environment. This requires sufficient knowledge of microfabrication processing steps such as photolithography, thin film deposition, dry etch, deep silicon etch, wafer bonding, etc.

Solid verbal and written communication skills in a multi-person team environment and enable cross-laboratory collaboration and coordination

Ability to conduct metrology such as optical/infrared microscope inspections, interferometric measurements and scanning electron microscopy with elemental analysis and is required. Design and characterize process control monitors (PCM) for in-process verification.

Hands-on experience with both surface and bulk micro-machining is highly desired.

Ability to design, modify and/or review mask layouts in CAD layout software such as L-Edit or Python is a major plus.

SPC/ Analysis Software such as JMP

Proper documentation of fabrication experiments

Back-end wafer process experience in wafer grinding, CMP, die singulation and assembly processes into packages is a plus

BS + 2/3 years of relevant experience or MS + 0/ 2 years of relevant experience. Relevant experience includes but is not limited to wafer fabrication/ process engineering. Candidates with different experience levels will be considered for other positions.

Must be able to perform safely in a MEMS microfabrication cleanroom and follow standard operating practices

US Citizenship. Ability to obtain and maintain a Security Clearance.

The base salary range for this full-time position is $99,705 - $124,683 + bonus + benefits.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.

We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.