Senior Staff Engineer, Advanced Package Technology Development & Design

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

• Support the development of advanced packaging solutions, including 2.5D architectures (e.g., CoWoS, EMIB, CPO, CPC).

• Perform SI/PI simulations under the guidance of senior engineers using industry-standard EDA tools.

• Assist in evaluating package and PCB designs to meet electrical performance targets.

• Collaborate with physical design and IP teams to support electrical optimization.

• Contribute to optoelectronic packaging efforts, including photonic component integration and co-design with electrical interconnects.

• Document analysis results and present findings to internal teams.

• Participate in cross-functional meetings and design reviews.

• Take ownership of assigned tasks and follow through to completion, adjusting approach as needed to meet goals.

What We're Looking For

• Bachelor's degree in Electrical Engineering or related fields and 5-10 years of related professional experience, or Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.

• Working knowledge of SI/PI principles and simulation tools (e.g., Ansys HFSS, Cadence Sigrity, Keysight ADS).

• Familiarity with substrate design, packaging materials, and assembly processes.

• Basic understanding of circuit extraction and simulation workflows.

• Hands-on experience with packaging co-design and electrical modeling.

• Familiarity with high-speed interfaces and power delivery networks.

• Exposure to optoelectronic packaging or interest in learning about photonic integration.

• Strong communication and collaboration skills.

Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

As part of our commitment to fair and authentic hiring practices, we ask that candidates do not use AI tools (e.g., transcription apps, real-time answer generators like ChatGPT, CoPilot, or note-taking bots) during interviews.

Our interviews are designed to assess your personal experience, thought process, and communication skills in real-time. If a candidate uses such tools during an interview, they will be disqualified from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.