Technical Fellow - High-Speed Interconnect & Optics

THE ROLE:

The Technical Fellow for High-Speed Interconnect and Optics is a senior technical leader responsible for defining and advancing NTSG's system-level interconnect architecture for next-generation AI, HPC, and data center platforms. This role drives innovation across electrical and optical interconnect technologies-spanning ASICs, advanced packaging, boards, optics, and full-system integration-while shaping industry direction and contributing to AMD's long-term technology roadmap

THE PERSON:

Defining next-generation interconnect architecture in this Lead role and long-term strategy for next-generation electrical and optical interconnects, including pluggable optics, co-packaged optics (CPO), co-packaged copper (CPC), and onboard optics (OBO), enabling scalable AI scale-up and scale-out system architectures.

KEY RESPONSIBILITIES:

Drive System-Level SI/PI Excellence

• Provide technical authority and leadership in high-speed signal integrity (SI) and power delivery network (PDN) design across ASICs, packages, boards, connectors, and optical interfaces. Ensure robust, end-to-end performance at 112G, 224G, and beyond under real-world system operating conditions.

Lead Optical System Integration and Packaging Innovation

• Drive end-to-end optical system integration, including optics module architecture, silicon photonics, laser integration (internal and external), advanced packaging solutions, and thermal and power optimization for high-density systems.

Guide SerDes and ASIC Co-Optimization

• Influence SerDes architecture, specifications, modeling assumptions, and tuning strategies to ensure alignment between ASIC design and real-world channel behavior, optical characteristics, packaging constraints, and system-level requirements.

Hands-On Technical Leadership and Debug

• Serve as a hands-on technical authority during lab bring-up, characterization, and system debug. Resolve complex, cross-layer issues spanning SI/PI, optics, firmware, packaging, and system-level interactions across development and deployment phases.

Shape Industry Direction and Ecosystem Alignment

• Represent AMD as a technical leader in industry standards bodies and consortia (e.g., OIF, IEEE, PCI-SIG). Influence next-generation specifications, drive ecosystem alignment, and ensure AMD's interconnect roadmap leads and aligns with industry trends.

Mentor and Multiply Technical Impact

• Mentor senior engineers, architects, and emerging technical leaders. Establish best practices, architectural frameworks, and design guidelines to elevate technical excellence across teams and business units.

Influence Business and Product Strategy

• Act as a trusted technical advisor to senior leadership. Drive critical technical trade-offs, vendor and partner strategy, and product go/no-go decisions that materially impact product direction, risk, cost, and time-to-market.

PREFERRED QUALIFICATIONS:

• Deep expertise in high-speed signal integrity and power integrity (SI/PI, PDN) for advanced data rates (112G, 224G, and beyond).
• Strong experience across optical interconnect technologies, including:
• Pluggable optics (QSFP, OSFP)
• Co-Packaged Optics (CPO)
• Co-Packaged Copper (CPC)
• On-Board Optics (OBO)
• Proven experience in optical packaging and system integration, including silicon photonics, laser coupling strategies, and thermal and power management at scale.
• Hands-on experience with system bring-up, validation, and debug across ASICs, packages, boards, and optical subsystems.
• Strong understanding of SerDes architecture, equalization, FEC, and system-level channel modeling.
• Demonstrated ability to lead across organizational boundaries and influence vendors, partners, customers, and standards bodies.
• Track record of sustained technical leadership and architectural impact across multiple product generations.
• Recognized industry or academic thought leader; publications and patents a strong plus

ACADEMIC CREDENTIALS:

PhD / Master's in Computer Science, Electrical Engineering, Photonics, or a related technical field.

This role is not eligible for visa sponsorship.

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